Focus
We understand creep and how it drives overly conservative designs, probabilistic lifecycle management, and excess spare parts. Better data and more informed decisions can lead to substantial cost avoidance.
About 3D Strain
3D Strain develops cost-saving technology that improves structural health awareness on creep-limited parts and equipment.
We understand creep and how it drives overly conservative designs, probabilistic lifecycle management, and excess spare parts. Better data and more informed decisions can lead to substantial cost avoidance.
The 3D Strain founders have been granted over 30 patents covering digital image correlation, symbolic strain measurement methods, 2D optical strain measurement, and turbine-blade strain monitoring.
We're innovators and entrepreneurs with experience integrating new technologies into existing manufacturing and maintenance operations, with backgrounds in gas turbines, global supply chains, robotics and automation, and custom software development.
Our Technology
3D Strain has developed a patented method to measure localized deformation using deformation-indicating features, commercially available 3D scanning equipment, and proprietary analysis software.
Our goal is practical integration: improve structural-health information without requiring continuous instrumentation on the component.
Our Founders
Co-Founder · In Memoriam
Dr. William F. Ranson was a Distinguished Professor Emeritus of Mechanical Engineering at the University of South Carolina and an internationally recognized expert in experimental mechanics. A pioneering developer of Digital Image Correlation (DIC), he authored seminal work that transformed full-field, non-contact deformation and strain measurement.
During a career spanning more than five decades, Dr. Ranson led research and technology programs for government and industry and mentored numerous graduate students. He was a Fellow of both SEM and ASME and received national awards for engineering research and education. He later served as President of Direct Measurements, Inc., where he led development of novel high-temperature creep measurement technology acquired by GE. As a co-founder of 3D Strain, his insight and innovation were foundational to the technology we continue to advance today.
Co-Founder
Lex Pavlo has more than 45 years of leadership experience spanning global sales, business development, operations, and technology commercialization. At FedEx, he advanced to Global Sales Director, managing major international accounts and supporting global expansion and new product launches.
At Direct Measurements, Inc., Lex served as Vice President and Chief Operating Officer, leading operations and strategic business development for advanced structural sensing technologies. Following GE's acquisition of DMI's technology, he served as Program Director for its industrialization, managing budgets, supply chain, and internal and external partnerships. The program contributed to a broader initiative credited with $769 million in productivity. At 3D Strain, Lex leads business development and commercialization. He holds a BS in Business Administration from Villanova University.
Co-Founder
Dr. Gregg Hovis has spent four decades developing and deploying technologies across aerospace, nuclear operations, robotics, machine vision, structural health monitoring, and power generation. His career began developing and testing fighter-aircraft engine components at Pratt & Whitney, followed by engineering and technology development at Savannah River National Laboratory.
In 2001, he co-founded Direct Measurements, Inc., leading development of advanced optical strain-measurement technologies later acquired by GE. At GE Power, he led the technical integration of embedded turbine sensing technology that generated $61 million in productivity improvements over three years. Dr. Hovis has more than 30 patents spanning optical strain measurement, turbine monitoring, robotics, and related technologies. He holds BS, MS, and PhD degrees in Mechanical Engineering.
We welcome discussions with OEMs, service providers, equipment owners, and others interested in bringing this technology to market.